6th/7th Gen ASUS EX-B250-V7 Expedition LGA1151 DDR4 HDMI B250 ATX Motherboard
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About this item
- Intel LGA 1700 socket: Ready for 12th/13th/14th Gen Intel Core processors, support PCIe 5.0 and out of box Windows 11 ready.Bluetooth v5.2
- Enhanced Power Solution: 14+2 DrMOS power stages, ProCool sockets, military-grade TUF components, and Digi+ VRM for maximum durability and performance
- Comprehensive Cooling : VRM heatsink, PCH fanless heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility
- Ultra Fast Gaming Networking : WiFi 6 AX201 (802.11 ax), Intel I225-V 2.5Gb LAN, TUF LANGuard and TurboLAN technology
- Fastest Connectivity: 4x M.2/NVMe SSD, Front panel USB 3.2 Gen 2 Type-C header, USB Gen 2×2 Type-C and Thunderbolt 4 header
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- Intel LGA 1700 Socket: Supports 14th and 13th Gen Intel Core Series Processors
- DDR5 Compatible: Dual Channel DDR5, 4 DIMMs
- Sturdy Power Design: Twin 12+1+1 Phases Digital VRM Solution
- Comprehensive Thermal Design: Advanced Thermal Design, Enlarged MOSFET Heatsinks, M.2 Thermal Guard
- Next Gen Connectivity: PCIe 5.0, NVMe M.2, USB 3.2 Gen 2×2 Type-C
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- Intel® LGA 1700 socket: Ready for 12th&13th&14th Gen Intel® Core™ processors and Windows 11, support PCIe 5.0
- AI Motherboard : AI Overclocking, AI cooling, AI networking(GameFirst VI) and AI noise cancellation
- Robust Power Solution: 16+1 power stages with ProCool II power connector, high-quality alloy chokes and durable capacitors to support multi-core processors
- High-performance Gaming Networking: On-board WiFi 6 and Intel 2.5 Gb Ethernet with ASUS LANGuard
- Best Gaming Connectivity: Supports HDMI 2.0 and DisplayPort 1.4 output, and featuring quad M.2 and USB 3.2 Gen 2×2 Type-C and Front panel USB 3.2 Gen 2×2 Type-C connectors
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- Supports 13th gen Intel® Core™ desktop processors.
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- Intel LGA 1700 Socket: Supports 12th Gen Intel Core Series Processors
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- Commanding Power Design: 16+1+2 Digital VRM Design with 70A Power Stage with Tantalum Polymer Capacitors
- Cutting-Edge Thermal Design: Fully Covered Thermal Design and High Coverage MOSFET Heatsinks, Enlarged Thermal Guards
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- Triple display interfaces including High Definition Multimedia Interface
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